Only Corfin Industries is TMTI-qualified for tin whisker mitigation.
The three-year US Navy/CALCE/Raytheon TMTI study investigated the effectiveness and safety of Robotic Hot Solder Dip (RHSD) via extensive testing and destructive physical analysis of Corfin-processed parts. The TMTI study found that “in all cases, the existing finish was completely removed and no parts were damaged as a result of the process.”
Corfin also processes to the following industry specifications:
MIL-PRF-38534 and MIL-PRF-38535 for Solder Coverage
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
IPC/ANSI J-STD-001 for Trim and Form and Hot Solder Dip
IPC/ANSI J-STD-002 for Solderability Test
ANSI Standard EIA-481 for Tape and Reeling
Corfin is ISO 9001 and AS9100 registered.
We process to NASA, Military, Aerospace, and Manned Space Flight specifications.
For more information, please click here to download our Tin Whisker Brochure or please click here to download our ISO 9001/AS9100 certificate.