Corfin News Links

Fall 2009 Medical Electronics Manufacturing Magazine, "Damage-Free Alloy Conversion for Medical Components", by Tom Adams. As suppliers rid themselves of traditional lead solders, how do medical device manufacturers cope with the changes? The answer is provided by Corfin Industries.

March 2009. Joe Zaccari, Corfin VP, elected board member of The Electronic Components Certification Board (ECCB)

Dec 2008. Military & Aerospace Electronics Magazine's Tom Adams interviews Corfin's Managing Director, Don Tyler, on the TMTI process for tin whisker mitigation and GEIA-STD-0006: Standard gives guidance for alloy conversion using hot-solder dip.

April 2006. US Navy\CALCE\Raytheon TMTI Study Final Report is published, "Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation" http://www.bmpcoe.org/news/images/tinwhisker_report.pdf

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