Corfin News Links

This will be periodically updated as current news projects are published:

September 13, 2010 The Pb-free Electronics Risk Management (PERM) Consortium has released a White Paper entitled "Reliability Assessment of Lead-free Electronics in the Aerospace, Defense and High Performance Electronics Industries," which states that without rigorous assessment of application requirements, it is premature to rely solely on existing military and civilian specifications for qualification of systems containing lead-free assemblies in critical, high-reliability, harsh environment applications. Read the paper at http://www.aia-aerospace.org/assets/perm_paper_072010.pdf

Dec 2008. Military & Aerospace Electronics Magazine's Tom Adams interviews Corfin's Managing Director, Don Tyler, on the TMTI process for tin whisker mitigation and GEIA-STD-0006: Standard gives guidance for alloy conversion using hot-solder dip.

March 2009. Joe Zaccari, Corfin VP, elected board member of The Electronic Components Certification Board (ECCB)

April 2006. US Navy\CALCE\Raytheon TMTI Study Final Report is published, "Final Report on the Transformational Manufacturing Technology Initiative (TMTI) ManTech Research Project S1057: Tin Whisker Mitigation" http://www.bmpcoe.org/news/images/tinwhisker_report.pdf

Please call or email us for more information or to discuss a project.