What specifications does Corfin process comply with?
Please see the list of standards – including the TMTI process – here.
If you already have a trim and form specification for your device, complete a Customer Requirements Form and send your trim and form specification with sample parts to Corfin. Corfin will evaluate your samples and return them along with a quotation.
If you don’t have a lead preparation specification, provide Corfin with the mechanical package outline and your PCB pad layout, if it exists. Corfin will generate a trim and form specification and submit it for your approval. Once approved, Corfin will generate a quotation.
During the trim and form process, the leads of the device are clamped and trimmed, resulting in exposed base material. This results in potential assembly and solderability problems if the component leads are not hot solder dipped. Corfin performs hot solder dip on all devices after trim and form. This eliminates potential assembly problems such as poor solderability, dewetting, nonwetting, and oxidation. Corfin hot solder dips devices using solders such as Sn63Pb37 or SAC305 which are compatible with the solder paste used in the PCB assembly process. This provides for better overall solder joint strength.
The hot solder dipping process has the following benefits:
Plating of terminations is an chemical process. The finish thickness is typically 50-100 microinches, less than half that of a hot solder finish and commercial components usually have much less than the minimum required thickness of military standards. Plated leads have a short life before oxidation of the lead finish starts (typically 30 days) due to porosity.
Corfin maintains an ESD program to JESD-625. Our production areas have ESD dissipative tiles connected to ground. Each production area has separate temperature and humidity monitors and controls. All personnel wear ESD smocks, heel straps, continuously-monitored wrist straps, and finger cots. All paperwork is kept in static-safe travelers unless removed at least 12 inches from unprotected devices. Corfin has been certified by Military, Space, and Commercial companies to be < 50 volts ESD potential at the work surface.
Corfin processes lot sizes from small, prototype volumes to high, on-going production volumes: Corfin presently is processing over 5,000 different package styles. Typically, for any lot size greater than 100 units, there is no set-up charge.
Corfin processes thousands of different package styles, including Flat packs, QFPs, SOICs, SSOPs, TSSOPs, TSOPs, QSOPs LCCs, PGAs, ASICs, RF Power Transistors, GaAs MMICs, Fiber Optics, Lasers, SAW Filters, Chip Components, BGA’s and J-Lead Components.
Corfin can flush off existing termination finishes and replace with SAC305 or other desired alloy:
Corfin generates a Customer Process Authorization (CPA) sheet for each process. The CPA specifies the Customer’s exact process, handling, and packaging requirements. The CPA is reviewed and approved by Corfin’s Quality Assurance Manager and the Customer. It then becomes the controlling process specification. Corfin also processes a set-up part, which is verified by the processing engineer and Quality representative, to verify that the process is within specifications and maintains process and inspection data on all lots.
After the parts have been processed, Corfin packages the product in Matrix Trays, Tubes, Bulk, or Tape and Reel, as required per the Customer Requirements Form. Corfin can cross-reference your packaging requirements and provide a quotation for the appropriate package. If off-the-shelf shipping packages are not available, Corfin can provide custom Matrix Trays, Tubes, or Carrier Tape.
Corfin can trim and form devices using any of the following:
Call us at 1.603.893.9900. We’ll ask you to do the following:
- Request Quote