For clients that need to be RoHS-compliant, Corfin’s Robotic Hot Solder Dipping process can also be used to remove lead-bearing alloys from the terminations of electronic components. Significant advantages to Robotic Hot Solder Dip Pb-free (non-pure tin, e.g. SAC 305) termination finishes include mitigation of pure tin whiskers and outstanding solderability.
A Robotic Hot Solder Dip finish is optimal for high quality reflow soldering, significantly reducing touch-up and rework after reflow.
In addition to many ongoing gold and tin whisker prevention projects, Corfin maintains Robotic Hot Solder Dipping systems to removal of finishes containing Pb to meet RoHS compliance. These automated, high-capacity systems are capable of meeting your volume requirements.
For more information, please click here to download our Tin Whisker Brochure.