BGA Reballing

Corfin’s BGA Reballing process flushes all lead-free balls and alloy residue from the pads and replaces them with Tin-Lead balls. RHSD equipment remove the balls and refinish the pads resulting in 100% pad alloy replacement ensuring the strongest solder joint. Corfin’s reballing process has undergone extensive qualification testing at independent labs proving that the process is safe and reliable. Here are some of our reballing services:

  • Conversion to Tin-Lead
  • Conversion to RoHS  Compliance
  • Ball Attach to LGA, QFN, and DFN packages
  • LGA Gold Removal and Reballing

 

See our test results: E2V TechnologiesGennumMicron Technologies 1Micron Technologies 2.

For more information, click here to download our BGA Reballing Brochure.