Modification & Repair

• BGA Reballing for Conversion to Tin-Lead or RoHS-Compliance. Flushes all balls and alloy residue from the pads and replaces with balls of Sn63Pb37, SAC305, or any other specified alloy. Uses RHSD to remove the balls and refinish the pads results in 100% pad alloy replacement and ensures the strongest solder joint. For more information, click here to download our BGA Reballing Brochure.
• Trim and Form. Forms and trims straight leads for surface mount or through-hole components per the customer’s drawing or Corfin Industries can propose a drawing. A RHSD process typically follows this process to coat leads and prevent oxidization.
• Re-Conditioning of Bent Leads. Robotic process realigns leads that are bent and scans to verify results. A thorough pre-process inspection is done prior to reconditioning to determine if the lead damage is repairable.
• Lead-Attach to Leadless Chip Carriers. Reduce solder joint stress by attaching J-shape and L-shape leads to LCCs using thermocompression bonding. For more information please click here to download our Lead Attach Brochure.

For more information, please click here to download our Services Brochure.