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 Robotic
Hot Solder Dip (RHSD)
- Tin Whisker
Mitigation. US Navy qualified process removes 100% of
the pure tin and replaces it with SnPb (tin-lead) to prevent
tin whiskers. Parts can be processed per GEIA-STD-0006. For
more information, click here to download our Tin
Whisker Brochure.
- Lead-Free
Mitigation. Prevents weak solder joints by removing all
of the lead-free finish and replacing it with tin-lead.
- Restoration
of Solderability. Corrects finishes affected by poor
quality plating, oxidation, foreign material, or after removal
from printed circuit assemblies.
- Gold Mitigation.
Removes gold and replaces it with SnPb. Typically required to
cover the effective seating plane.
- RoHS Compliance.
Removes the lead-bearing alloy and replaces it with SAC305 (tin-silver-copper)
or any other specified alloy.
For more information, please click
here to download our Services Brochure.
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