Test

• X-Ray Fluorescence Analysis (XRF). Used to determine Lead (Pb) content of termination finishes and plating thickness.
• Fine and Gross Leak Testing. Also referred to as Seal Test, these tests verify that the hermetic seal of a component is intact and typically follows trim and form and/or RHSD of a glass-sealed device.
• Solderability Testing. Verify termination finishes will readily accept solder during assembly using J-STD-002 test or other military specification.
• Cleanliness Testing. Determines ionic contamination on the part that can cause current leakage between leads.

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