TMTI & Other Industry Standards

Corfin Industries processes to a Customer Process Authorization based on customer specifications and drawings:

Only Corfin Industries is TMTI-qualified for tin whisker mitigation.

• The three-year US Navy/CALCE/Raytheon TMTI study investigated the effectiveness and safety of Robotic Hot Solder Dip (RHSD) via extensive testing and destructive physical analysis of Corfin-processed parts.
• The TMTI study found that "in all cases, the existing finish was completely removed and no parts were damaged as a result of the process."
• Please click here to read the final TMTI report. *
  

Corfin also processes to the following industry specifications:

• MIL-PRF-38534 and MIL-PRF-38535 for Solder Coverage
• GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
• IPC/ANSI J-STD-001 for Trim and Forming and Hot Solder Dip
• IPC/ANSI J-STD-002 for Solderability Test
• ANSI Standard EIA-481 for Tape and Reeling
  

Corfin is ISO 9001 and AS9100 registered. We process to NASA, Military, Aerospace, and Manned Space Flight specifications. For more information, please click here to download our Tin Whisker Brochure.

* Mantech Project s1057