About Us


Corfin pioneered Robotic Hot Solder Dip technology – the only process approved by the US Navy TMTI Project S1057 to eliminate the risk of tin whiskers and weak solder joints without potential damage to the component – and with over 25 years’ experience our technicians have mastered component preparation solutions with Corfin RHSD machinery.


Converting Pb-free components to SnPb

  • Robotic Hot Solder Dip
  • BGA Reballing

Component preparation services

  • Lead Forming
  • Reconditioning
  • J-lead attach

Electronics manufacturing and support

  • PCB Assembly and Rework
  • Component Harvesting
  • Kitting
  • Testing


  • Intimate RHSD knowledge – Corfin Industries technicians have decades of aggregate experience with Corfin RHSD machinery
  • Package Types – Process flexibility for any type of component: fine pitch quad flat packs, PLCC, SIP, DIP, LCC, Hybrid MCM, PGA, SOIC, 4 mil TAB devices, SMT connectors, BGA, QFN, DO, TO, Axials, Contacts, Magnetics
  • Small Packages – Corfin Industries uses proprietary custom tooling to handle parts as small as 01005 (metric 0402)
  • Complex Packages – In-house engineering staff designs proprietary masks and tooling for challenging package types
  • Flexible Packaging Options – Devices processed to/from tube, trays, carrier tape or bulk


  • MIL-PRF-38534 and MIL-PRF-38535 for Solder Coverage
  • GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
  • IEC TS 62647-4 Ball grid array (BGA) re-balling
  • Nadcap AC7120/11 Accredited
  • J-STD-001 for Trim and Form and Hot Solder Dip
  • J-STD-002 for Solderability Test
  • IPC-610 Acceptability of Electronics Assemblies
  • ANSI Standard EIA-481 for Tape and Reeling
  • ISO 9001 and AS9100 registered
  • Process to NASA, Military, Aerospace, and Manned Space Flight specifications Leadership and participation in standards development efforts demonstrate our commitment to our customers’ need for the highest possible product reliability.


Corfin precision in-line robotics provide:

  • Consistent angles and rates of immersion and emersion
  • Vision alignment and inspection
  • Dynamic flux waves constantly monitored for specific-gravity
  • Inert nitrogen atmosphere to eliminate icicling and bridging
  • Flat dynamic solder wave technology for even solder thickness and coplanarity
  • Ultra-filtered rinse baths ensuring part cleanliness post processing
  • Multiple controls for tight regulation of temperatures and dwells