Standards and TMTI


Our leadership in the development of industry standards to eliminate Pb-free risks demonstrates our commitment to providing the highest quality services to our customers. We have embraced the standards development process and adherence to the resultant standards to ensure that processes are precise, automated to the extent possible, and verifiably repeatable.  In mission critical systems failure is simply not an option.

Standards we Process to:

  • MIL-PRF-38534 and MIL-PRF-38535 – Solder Coverage
  • GEIA-STD-0006 Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts*
  • IEC TS 62647-4 – Ball Grid Array (BGA) Reballing*
  • IPC/ANSI J-STD-001 with Space Addendum – Trim and Form and Hot Solder Dip
  • IPC/ANSI J-STD-002 – Solderability Testing
  • ANSI Standard EIA-481  – Tape/Reel packaging
  • Process to NASA, Military, Aerospace, and Manned Space Flight specifications Leadership and participation in standards development efforts demonstrate our commitment to our customers’ need for the highest possible product reliability.

*Corfin lead the teams that developed these standards.


A three-year US Navy/CALCE/Raytheon TMTI study investigated the effectiveness and safety of Robotic Hot Solder Dip (RHSD) for Tin Whisker mitigation through extensive testing and destructive physical analysis of Corfin-processed devices. The TMTI study found that “in all cases, the existing finish was completely replaced and no parts were damaged as a result of the process.”

For more Tin Whisker  information, please click here to download our Tin Whisker Brochure