Test

Fine and Gross Leak

Also referred to as Seal or Hermeticity Test, this test verifies that the hermetic seal of a component is intact and typically follows trim and form and/or RHSD of a glass seal device.

GEIA-STD-0006 Finish Replacement Qualification

The industry specification for conversion of Pb-free to tin-lead termination finishes is easily satisfied by Corfin’s process. Most customers decline the test requirements based upon confidence of Corfin’s robotic process, but testing is readily available at Corfin.

IEC TS 62647-4 Qualification Ball grid array (BGA) re-balling

The industry specification for conversion of Pb-free BGAs to tin-lead solder balls finishes is satisfied by Corfin’s process. Most customers decline the test requirements based upon confidence of Corfin’s robotic process, but testing is readily available at Corfin.

Ionic Contamination

Detects ionic contamination on the part that can cause current leakage between leads.

Solderability

Verifies termination finishes will readily accept solder during assembly using J-STD-002 or any military test method.